| 摘要 |
PROBLEM TO BE SOLVED: To provide a module for a non-contact IC card which is thin, smooth, inexpensive and also highly strong without providing a reinforcing plate, and a non-contact IC card using the module for a non-contact IC card. SOLUTION: An IC 104 is provided on one surface of an insulation resin plate 101 provided with conductor foil 102 where a pattern is worked only on the other surface and with a connection hole 108 connecting the bump 105 of the IC to the conductor foil, and the bump of the IC is connected to the conductor foil in the connection hole to be mounted. The module for a non- contact IC card is used. |
