| 摘要 |
PROBLEM TO BE SOLVED: To realize a process having repeatability for depositing a film having a uniform thickness under the influence of a controlled-temperature and controlled-pressure environment. SOLUTION: A deposition chamber is provided for depositing materials which require vaporization, especially, low volatility precursors. The precursors are transported as a liquid to a vaporizer which converts the materials to vapor phase through one or more vaporizing elements, and which must be transported at elevated temperatures to prevent unwanted condensation on chamber components. In one aspect, the chamber comprises a series of heated temperature controlled internal liners as vaporizing surfaces which are configured for rapid removal, cleaning and/or replacement, and preferably are made of a material having a thermal coefficient of expansion close to that of the deposition material. The vaporizing surfaces 'flash' sprayed liquid precursors on the surface of the vaporizing surfaces and then purify the flashed precursors before flowing into the system.
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