| 摘要 |
PROBLEM TO BE SOLVED: To achieve a compact, multiple-terminal resin-sealing semiconductor device. SOLUTION: A plurality of leads 2 for transmitting signals that are made of copper foil, and a die pad 3 are allowed to adhere onto an insulating film 6. A terminal land film is used, where the terminal land film has a terminal land 5 that is connected to the lands 2 for transmitting signals, projects from a hole 20 of the film 6, has a recessed part 5-1 inside, and is made of the copper foil. A semiconductor device 13 is bonded onto the die pad 3 by an adhesive 16 for connecting the semiconductor device 13 to the lead 2 for connecting signals by a metal thin wire 14, and the lead 2 for transmitting signals, die pad 3, semiconductor device 13, metal thin wire 14, and recessed part 5-1 of the terminal land part 5 are sealed into a sealing resin 15. |
