发明名称 |
Apparatus for mapping scratches in an oxide film |
摘要 |
A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that when short wavelength light is directed on the monitor wafer, scratches through the second layer can be detected.
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申请公布号 |
US6291833(B2) |
申请公布日期 |
2001.09.18 |
申请号 |
US19990464486 |
申请日期 |
1999.12.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LANDERS WILLIAM FRANCIS;SINGH JYOTHI |
分类号 |
H01L21/66;H01L23/544;(IPC1-7):H01L23/58 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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