| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid short-circuiting between pads caused when solder is supplied to a defective electrode of an electronic component in a wiring substrate and moved to a wiring substrate adjacent thereto. SOLUTION: In order to adsorb solder supplied to a defective wiring substrate in an integrated substrate, a dummy part made of material having a good solder wettability is mounted on the defective wiring substrate to adsorb the unnecessary solder to the dummy component without moving it to a good wiring substrate at the time of solder melting.</p> |
