发明名称 EQUIPMENT AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent unnecessary oxidation while preventing generation of dust or cost increase. SOLUTION: A diffusion equipment 1 comprises a process tube 3 defining a treating chamber 4 having a furnace opening 5 at the lower end, a boat 21 entering or exiting the treating chamber 4 to carry wafers 20 into the treating chamber 4 or carry out the wafers 20 therefrom, a chamber 13 having a preliminary chamber 14 to wait for the boat 21 disposed below the process tube 3, a seal flange 30 having an opening 31 for passing the boat 21 interposed between the treating chamber 4 and the preliminary chamber 14, and a seal cover 35 disposed oppositely to the boat 21 on the treating chamber side of the seal flange 30 while being seated removably to close an opening 31. Since the seal cover seals the flange when the boat is waiting in the preliminary chamber, the preliminary chamber can be brought into an inert gas atmosphere. Furthermore, a driver for opening/closing the seal flange can be eliminated because the boat lifts and seats the seal cover when it is carried into the treating chamber.
申请公布号 JP2001250787(A) 申请公布日期 2001.09.14
申请号 JP20000060875 申请日期 2000.03.06
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TOMEZUKA KOJI
分类号 C23C16/44;C30B25/08;C30B31/10;H01L21/205;H01L21/22;H01L21/677;(IPC1-7):H01L21/22 主分类号 C23C16/44
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