| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique of cheaply manufacturing a resin molded electronic power module having high heat radiation and high reliability. SOLUTION: A method of manufacturing a metal base circuit board comprises a step of mounting electric components through a good thermal conductivity insulation layer 8 on one main surface of a metal plate 1 with slits, and laminating a lead frame 2 molded with resin leaving terminals in the form of the terminals partly extruding into the slits, thus forming a mother board 10 of circuit boards, and a step of cutting the mother board 10 at the slits into individual circuit boards.</p> |
