发明名称 THERMAL EXPANSION COMPENSATION FOR MODULAR PRINTHEAD ASSEMBLIES
摘要 <p>A printhead assembly for an ink jet printer that has an elongate support member (1) that attaches to the printer and a printhead (2) that mounts to the support member (1). The printhead has an array of ink ejection nozzles formed in a substrate material. The support member (1) is formed from a number of materials (3, 4) having different coefficients of thermal expansion. The support member materials (3, 4) are selected and structurally configured so that the effective coefficient of thermal expansion of the support member as a whole substantially matches that of the nozzle substrate material. The support member (1) is also structurally configured so that it does not bow with temperature change.</p>
申请公布号 WO2001066354(A1) 申请公布日期 2001.09.13
申请号 AU2001000238 申请日期 2001.03.06
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