发明名称 |
Warpage compensating heat spreader |
摘要 |
A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.
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申请公布号 |
US6288900(B1) |
申请公布日期 |
2001.09.11 |
申请号 |
US19990453124 |
申请日期 |
1999.12.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOHNSON ERIC A.;PARK SEUNGBAE |
分类号 |
H01L23/31;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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