| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can secure the connecting reliability of the outside terminals and the reliability of wiring and can be manufactured in low cost by the wafer process. SOLUTION: This solution can provide a semiconductor device in low cost which can be fit to laminate with the state of wafer and which can use the forming and processing of the insulating films and the forming process of the wires, through absorbing the heat strains caused in the differences in the line expansion coefficients of the semiconductor device 1 and the printed circuit board 10 and decreasing the strains generating in the outside terminals 9 by means of deforming the first insulating films 4 with a small modulus of elasticity standing between the outside terminal 9 and the semiconductor device 1, and through securing the reliability of the land 6 and the wires 7 by means of standing the second insulating films 5 with a larger modulus of elasticity than the first insulating films 4 between the first insulating films 4 and the land 6 and wires 7.
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