摘要 |
PROBLEM TO BE SOLVED: To provide radiating structure of a heat generating component which can improve heat dissipation efficiency of heat generating components with a simple structure without restraining the formation of a circuit pattern of a circuit board. SOLUTION: This radiating structure is provided with a circuit board 1 on which circuit components including the heat generating components 2, 3 are mounted, and a metal case 4 which is fixed to the circuit board 1 at a specified interval. Between the circuit board 1 and the metal case 4, a radiating member 9 wherein the upper surface abuts against the heat generating component 2 mounted on the circuit board 1, and the lower surface abuts against the upper surface of the metal case 4, and a radiating part 6 formed by cut the metal case 4 upward wherein the upper surface 6a of the part 6 abuts against the lower surface of the heat generating component 3 mounted on the circuit board 1, via an aperture part 1a formed in the circuit board 1, are installed.
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