发明名称 RADIATING STRUCTURE OF HEAT GENERATING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide radiating structure of a heat generating component which can improve heat dissipation efficiency of heat generating components with a simple structure without restraining the formation of a circuit pattern of a circuit board. SOLUTION: This radiating structure is provided with a circuit board 1 on which circuit components including the heat generating components 2, 3 are mounted, and a metal case 4 which is fixed to the circuit board 1 at a specified interval. Between the circuit board 1 and the metal case 4, a radiating member 9 wherein the upper surface abuts against the heat generating component 2 mounted on the circuit board 1, and the lower surface abuts against the upper surface of the metal case 4, and a radiating part 6 formed by cut the metal case 4 upward wherein the upper surface 6a of the part 6 abuts against the lower surface of the heat generating component 3 mounted on the circuit board 1, via an aperture part 1a formed in the circuit board 1, are installed.
申请公布号 JP2001244665(A) 申请公布日期 2001.09.07
申请号 JP20000052782 申请日期 2000.02.29
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC LIGHTING CORP 发明人 FUKUDA MAKOTO;YASHIRO YASUNORI;WADA NAOKI;ISHIKAWA OSAMU
分类号 H05K7/20;H05K7/04;(IPC1-7):H05K7/20 主分类号 H05K7/20
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