Polyimide obtained using polyamic acid, is useful as a high temperature adhesive used for semiconductor assemblies and insulative adhesive tape

摘要

Polyimide is obtained through the thermal imidization of polyamic acid. Polyamic acid is represented by formula (I). R = tetravalent organic group selected from group of formulae (a); R1 = divalent organic group selected from group of formulae (b); R2 = trivalent or tetravalent organic group selected from group of formulae (c) R3 = divalent organic group of formula (d); R4 = 1 - 20C alkylene group; n' = recurring unit; and l, m, and n = molar numbers corresponding recurring units under the condition that l / (m + n) is 99.985/0.015 - 80/15 as expressed in terms of molar ratio and l / (m + n) is 1/2000 - 500/1 as expressed in terms of molar ratio. An Independent claim is also included for a polyimide represented by formula (II).