发明名称 Semiconductor device with capacitive element and method of forming the same
摘要 The present invention provides a semiconductor device having at least a multilevel metal interconnection structure, at least a capacitor which lies over the multilevel metal interconnection structure, and an inter-layer insulator under the capacitor and over the multilevel metal interconnection structure for isolating the multilevel metal interconnection structure form the capacitor, wherein at least an anti-oxidizing film preventing penetration of oxygen is provided in the inter-layer insulator, so that the anti-oxidizing film lies covering the multilevel metal interconnection structure and under the capacitor.
申请公布号 US2001019141(A1) 申请公布日期 2001.09.06
申请号 US20010774041 申请日期 2001.01.31
申请人 NEC CORPORATION 发明人 TAKAHASHI SEIICHI
分类号 H01L27/04;H01L21/02;H01L21/768;H01L21/822;H01L21/8242;H01L27/06;H01L27/10;H01L27/108;(IPC1-7):H01L21/00 主分类号 H01L27/04
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