发明名称 |
METHOD OF PRODUCING PHENOL RESIN |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a phenol resin that can be used as a curing agent for semiconductor sealing material as it includes a reduced amount of ionic impurities and has a low molecular-weight and a low melt viscosity. SOLUTION: When a phenol and an aldehyde are allowed to react with each other to produce a phenol resin, a salt formed by the neutralization reaction between an acid and a base is used as a polymerization catalyst. The weight of the salt is 0.01-5 wt.% based on the whole weight of the phenol and the aldehyde. The catalyst is removed by washing with water or extraction treatment whereby the resultant phenol resin includes a reduced amount of ionic impurities and is useful as a curing agent for a semiconductor-sealing epoxy resin.
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申请公布号 |
JP2001240644(A) |
申请公布日期 |
2001.09.04 |
申请号 |
JP20000053600 |
申请日期 |
2000.02.29 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
IDENO TAKATSUGU;YAMAGISHI KAZUYOSHI;ICHIKAWA TETSUSHI |
分类号 |
C08G8/08;C08G8/00;(IPC1-7):C08G8/08 |
主分类号 |
C08G8/08 |
代理机构 |
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