发明名称 METHOD OF PRODUCING PHENOL RESIN
摘要 PROBLEM TO BE SOLVED: To provide a method of producing a phenol resin that can be used as a curing agent for semiconductor sealing material as it includes a reduced amount of ionic impurities and has a low molecular-weight and a low melt viscosity. SOLUTION: When a phenol and an aldehyde are allowed to react with each other to produce a phenol resin, a salt formed by the neutralization reaction between an acid and a base is used as a polymerization catalyst. The weight of the salt is 0.01-5 wt.% based on the whole weight of the phenol and the aldehyde. The catalyst is removed by washing with water or extraction treatment whereby the resultant phenol resin includes a reduced amount of ionic impurities and is useful as a curing agent for a semiconductor-sealing epoxy resin.
申请公布号 JP2001240644(A) 申请公布日期 2001.09.04
申请号 JP20000053600 申请日期 2000.02.29
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IDENO TAKATSUGU;YAMAGISHI KAZUYOSHI;ICHIKAWA TETSUSHI
分类号 C08G8/08;C08G8/00;(IPC1-7):C08G8/08 主分类号 C08G8/08
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