| 摘要 |
The present invention provides a method for formation of a pattern of a photosensitive resin composition, which method is superior in sensitivity and film-thinning ratio, generates no scum in pattern formation, and gives a high resolution. That is, the present invention lies in a method for forming a pattern of a photosensitive resin composition, which comprises coating, on a substrate or the like, a positive photosensitive resin composition composed of a polyamide of particular structure and a diazoquinone compound, subjecting the resulting material to prebaking and then to light exposure, and dissolving and removing the exposed portions of the material with an aqueous alkaline solution containing an anionic surfactant and at least one kind of compound selected from compounds of calcium, strontium and barium, to obtain a pattern. The feature of the present invention lies particularly in using such an aqueous alkaline solution as a developing solution.
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