CLEANER FOR CUP TYPE PLATING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique by which excellent plating is available for a long time even when wafers each provided with a seed metal are sucessively plated with a cup type plating device. SOLUTION: A plating solution depositing on a wafer supporting part 3 provided along the upper opening of a plating tank 2 of the cup type plating device 1 is removed by this cleanser 7. The cleaner is furnished with a cleaning mechanism 13 for supplying cleaning water to the wafer supporting part 3 and a suction mechanism 14 for sucking and removing the plating solution and cleaning water depositing on the wafer supporting part 3.