| 摘要 |
PROBLEM TO BE SOLVED: To provide a flattening method which is capable of polishing a work uniformly. SOLUTION: A flattening method through which the processed surface of a work is flattened by polishing it with a polishing pad comprises a first step (1) in which the polishing pad is so located on the processed surface of the work as to enable the processed surface to appear partially out of the polishing pad at two positions; a second step (2) in which the processed surface of the work is brought into contact with the polishing pad to produce pressure between them; and a third step (3) in which the work is rotated on its center axis, and the polishing pad is swung to polish the processed surface of the work, and the retention time of the polishing pad is varied at each position on the processed surface of the work, by which the processed surface of the work can be processed as much as prescribed at each position. |
