发明名称 HEAT TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide heat treatment equipment which is capable of thermally and uniformly treating a substrate with a lid kept nearly uniform in temperature distribution. SOLUTION: A heat treatment equipment which heat-treats a substrate W at a prescribed temperature is equipped with a heating plate 51 where the substrate W is mounted or provided proximate, a lid 62 which covers the surface of the heating plate 51 to form a processing chamber S during the heat treatment of the substrate W, and a heat pipe 65 which is formed by filling the inner space 62c of the lid 62 with hydraulic fluid 66.
申请公布号 JP2001237171(A) 申请公布日期 2001.08.31
申请号 JP20000047512 申请日期 2000.02.24
申请人 TOKYO ELECTRON LTD 发明人 SHIRAKAWA HIDEKAZU
分类号 F28D15/02;H01L21/027;(IPC1-7):H01L21/027 主分类号 F28D15/02
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