| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which connection pads are formed and which has a high degree of freedom for design. SOLUTION: This wiring board 1 is provided with via conductors 25, connection pads 26 which are electrically connected to the conductors 25, and interlayer conductors 19P1, etc., which are positioned closely to the conductors 25 and insulated from the conductors 2. The via conductors 25 are partially contained in the pads 26. The distance K2 from the center axis 25J of each via conductor 25 to the nearest interlayer conductor 19P1S is made longer than the distance K1 from the center axis 26J of each pad 26 to the nearest interlayer conductor 19P1S. |
