| 摘要 |
The present invention provides a technique for removing air remaining on the peripheral edge of a surface to be plated in a conventional wafer plating apparatus, and to provide a wafer plating apparatus capable of performing a more uniform plating up to the peripheral edge of the surface to be plated, and which is further capable of performing plating even with respect to a wafer coated with a seed metal. This wafer plating apparatus includes a wafer clamp 6 for holding a wafer 4, a wafer support member 7 for supporting the periphery of the surface 5 to be plated of the wafer 4, and a plating tank 2 for circulating a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged so as to perform plating, while the surface 5 to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer 4 is clamped by the wafer clamp 6 and the wafer support member 7. In this wafer plating apparatus, the wafer support member 7 is equipped with air-vent holes 12 for discharging air remaining on the peripheral edge of the surface 5 to be plated while the surface of the plating solution and the wafer 4 are made contact with each other.
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