发明名称 Integrated circuit package pin indicator
摘要 An integrated circuit package pin indicator that may include probe guides. The indicator includes a top marking plate with indicia for the multiple pins of the IC package. The top plate has individual indicia for each pin, and will have numerical or alpha labels for some or all of the pins, depending on the number of pins present. The top marking plate may include a securing means to attach the top marking plate to the top of the IC package and to hold the top marking plate in place. Each pin marker terminates in a hole or slot that is adapted to guide a probe to a selected pin. The pin indicator can be used with both through hole and surface mount IC boards.
申请公布号 US6281695(B1) 申请公布日期 2001.08.28
申请号 US19990450924 申请日期 1999.11.29
申请人 CHUNG ROBBIE M. K.;CHUNG ELYNNA M. C. 发明人 CHUNG ROBBIE M. K.;CHUNG ELYNNA M. C.
分类号 G01R1/04;G01R31/28;H01L23/544;(IPC1-7):G01R31/02 主分类号 G01R1/04
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