发明名称 Socket apparatus for IC packages
摘要 A socket (10) having a base (12), an adapter (24) which has a mounting seat for a semiconductor device (100) and which is installed on the base, and a plurality of contact members (14) which are caused to engage respective terminals of the semiconductor device that has been placed on the mounting seat of the adapter. Each contact member (14) has a pair of arms (90, 130, 144) provided by the bifurcation of one end, with the other end being fixed to the base. Each contact member is caused to nip a respective terminal (102) of the semiconductor device arranged on the mounting seat at the tip portion of the pair of arms and has butting surfaces (92, 131, 148) that determine the minimum spacing distance of the tip portions of the arms on the opposing sides of each pair of arms. Contact members (14) are connected to socket terminals (21) via a connector including an expansion board (20), conductive wires (150, 160), flexible printed substrate (170), sockets (190, 200, 214) and lead guides (222, 224) in several embodiments.
申请公布号 US6280219(B1) 申请公布日期 2001.08.28
申请号 US20010753479 申请日期 2001.01.03
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 SANO HIDEKI;IKEYA KIYOKAZU
分类号 G01R31/26;G01R1/073;H01L23/32;H01R13/193;H01R24/00;H01R33/76;(IPC1-7):H01R11/22 主分类号 G01R31/26
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