| 摘要 |
PROBLEM TO BE SOLVED: To provide wafer cutting equipment equipped with two spindles and a method wherein the equipment can be improved in cutting efficiency, throughput, and cutting quality by specifying the best directions of rotation of the two spindles. SOLUTION: This dicing equipment 10 cuts out a wafer W by two spindles 34 and 36 which are arranged in face to face with each other and rotating each in opposite directions. When the two spindles 34 and 36 are rotated in the same direction, both a down-cutting and an up-cutting operation can be carried out at the same time. On the other hand, when the spindles 34 and 36 are arranged in parallel and rotated in reverse directions to cut out a wafer W, both a down-cutting and an up-cutting operation can be carried out at the same time. |
