| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board circuit board which can reduce manufacturing cost and stabilize interlayer connection resistance. SOLUTION: There is formed a non-through hole 18 which reaches a copper foil 12 by conducting a laser irradiation from one face of an insulation base material 10, in which the copper foil 12 is stuck, to the other face. A conductive paste 20 is filled in the non-through hole 18 by vacuum pressure deaerating to form a filling via hole 22, and a resin adhesives layer 14 is provided on an insulation base material 10 on the side of exposing the conductive paste 20. After a copper foil 24 is hot-bonded via the adhesives layer 14, a both-face circuit plate having conductive circuits 26, 28 is manufactured through etching process. Similarly, the copper foil of the insulation base material 10, in which the copper foil 12 is stuck to one face, is etched to form a conductive circuit 34. Laser irradiation is conducted from the other face of the insulation base material 10, to form the non-through hole 18 which reaches the conductor circuit 34. The conductive paste 20 is filled in the non-through hole 18 by vacuum pressure deaeration to form a via hole 22, to manufacture a one-face circuit substrate 40. |
