发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a new semiconductor device. SOLUTION: This method is characterized by that an amorphous semiconductor film is formed on an insulating body; nickel is added to the amorphous semiconductor film; a heat treatment is performed to the amorphous semiconductor film to crystallize the amorphous semiconductor film; the crystallized semiconductor film is subjected to a heat treatment in an oxidizing atmosphere to oxidize part of the crystallized semiconductor film; and a plurality of semiconductor films isolated form each other by the oxidation are used for a channel forming region to form a plurality of thin film transistors.
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申请公布号 |
JP2001230424(A) |
申请公布日期 |
2001.08.24 |
申请号 |
JP20010004210 |
申请日期 |
2001.01.11 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
TAKEMURA YASUHIKO;ADACHI HIROKI |
分类号 |
H01L21/316;H01L21/20;H01L21/336;H01L21/76;H01L21/762;H01L29/786;(IPC1-7):H01L29/786 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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