发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a new semiconductor device. SOLUTION: This method is characterized by that an amorphous semiconductor film is formed on an insulating body; nickel is added to the amorphous semiconductor film; a heat treatment is performed to the amorphous semiconductor film to crystallize the amorphous semiconductor film; the crystallized semiconductor film is subjected to a heat treatment in an oxidizing atmosphere to oxidize part of the crystallized semiconductor film; and a plurality of semiconductor films isolated form each other by the oxidation are used for a channel forming region to form a plurality of thin film transistors.
申请公布号 JP2001230424(A) 申请公布日期 2001.08.24
申请号 JP20010004210 申请日期 2001.01.11
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TAKEMURA YASUHIKO;ADACHI HIROKI
分类号 H01L21/316;H01L21/20;H01L21/336;H01L21/76;H01L21/762;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/316
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