发明名称 Coating film forming apparatus and coating film forming method
摘要 A coating film forming apparatus comprising a coating solution supplying unit which supplies a coating solution to a rotating substrate, a memory which stores a first correlation between an atmospheric pressure and a film thickness of the coating film formed on the substrate, and a second correlation between a film thickness and a rotation speed of the substrate, an atmospheric pressure detector which detects an actual atmospheric pressure, a film thickness computation unit which computes an actual film thickness of the coating film from the actual atmospheric pressure based on the first correlation, and a rotation speed control unit which obtains a corrected rotation speed of the substrate based on the second correlation and a difference between the actual film thickness and a target film thickness, and rotate the substrate at the corrected rotation speed.
申请公布号 US2001016225(A1) 申请公布日期 2001.08.23
申请号 US20010783999 申请日期 2001.02.16
申请人 OGATA KUNIE;UEMURA RYOICHI;TATEYAMA MASANORI;NISHIGAKI TOSHIHIKO 发明人 OGATA KUNIE;UEMURA RYOICHI;TATEYAMA MASANORI;NISHIGAKI TOSHIHIKO
分类号 B05C11/08;H01L21/00;(IPC1-7):B05D3/12 主分类号 B05C11/08
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