发明名称 |
Thin film multilayer capacitor and mounting method therefor |
摘要 |
A thin film multilayer capacitor and a method for mounting it are provide wherein the capacitor is small and thin, can furnish a large capacitance, and is hard to be damaged at the time of mounting on a wiring substrate. The thin film multilayer capacitor 10 comprises a substrate 12 and a laminated body 14 formed thereon. The laminated body 14 is formed by laminating electrode layers 16 and dielectric layers 18. The electrode layers 16 are divided into a first group of electrode layers 16a and a second group of electrode layers 16b by the dielectric layers 18. The electrode layers 16a of the first group and the electrode layers 16b of the second group are laminated in an alternate manner with the dielectric layers 18 intervening therebetween, the plurality of electrode layers 16a of the first group are connected with each other, and the plurality of electrode layers 16b of the second group are also connected with each other. A protective film 20 is formed on the surrounding surfaces of the laminated body 14, and solder bumps 24 are formed at the openings 22.
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申请公布号 |
US2001015884(A1) |
申请公布日期 |
2001.08.23 |
申请号 |
US20010773642 |
申请日期 |
2001.01.31 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TAKESHIMA YUTAKA;SAKABE YUKIO |
分类号 |
H01G4/252;H01G4/30;H01L21/60;(IPC1-7):H01G4/228 |
主分类号 |
H01G4/252 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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