| 摘要 |
An apparatus and method for processing substrates is provided, wherein the apparatus includes at least one substrate carrier for transporting a substrate within a processing environment. At least one temperature controlled plate positioned in the processing environment is selectively in communication with the at least one substrate carrier and is used to both transfer substrates from an external substrate shuttle to the substrate carrier in the processing environment and to regulate the temperature of the processing environment. At least one deposition device configured to deposit a selected film on the substrate and an annealing device are positioned proximate the at least one substrate carrier within the processing environment.
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