| 摘要 |
<p>A polishing composition, for use in polishing a copper layer or a tantalum or tantalum compound layer on a substrate, comprises an abrasive, an anticorrosive, an oxidising agent, an acid, a pH regulator and water and has a pH within a range of from 2 to 5. The abrasive is colloidal silica or fumed silica, and has a primary particle size of at most 20 nm.</p> |
