| 摘要 |
PROBLEM TO BE SOLVED: To obtain a HIP joined body of beryllium and a copper alloy moreover improved in joining reliability by effectively preventing rupture in the boundary between the copper alloy and an intermediately formed layer even in the case of low joining temperature. SOLUTION: At the time of joining beryllium and the copper alloy, a thin layer of Ti, V, Nb, Cr, Mo or Si is formed on the surface of the copper alloy as a diffusion suppressing layer for Al and copper by a PVD method or a thermal spraying method, if required, a pure Al layer or an Al alloy is successively formed on the surface of the diffusion suppressing layer as a joining promoting layer, and next, the copper alloy and beryllium subjected to such surface treatment are subjected to HIP joining under the insertion of an inserting material composed of a clad material, with an Al-Si-Mg alloy, an Al-Mg alloy or Al as a core material, consisting of those alloys. |
