发明名称 UNDRIED COATING FILM FOR SOLDERING AND SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a novel paste composition for aluminum soldering which composition gives a coating film easy in handling and plasticity processing, provides the soldered area (fillet) having a good appearance, keeps a good operation environment at a low cost and is applicable to a part having a complex shape. SOLUTION: The undried coating film is obtained by coating at least a part of an aluminum part with a composition containing following (a)-(c), the rest of which virtually consists of an organic solvent (The total amount does not exceed 100 wt.%.): (a) 10-70 wt.% of a metal powder for soldering, (b) 2-70 wt.% of a fluoride flux, and (c) 0.1-10 wt.% of a binder consisting of at least one selected from a butyl rubber, a petroleum resin and a polyethylene resin.
申请公布号 JP2001226541(A) 申请公布日期 2001.08.21
申请号 JP20000039924 申请日期 2000.02.17
申请人 TOYO ALUMINIUM KK 发明人 WATSUJI TAKASHI;KATO SEIZO;MATSUMURA MASARU;KIKUCHI TAKESHI
分类号 B23K1/19;B23K1/20;B23K35/363;C08K3/08;C08K3/16;C08L23/04;C08L23/22;C08L57/02;(IPC1-7):C08L23/04 主分类号 B23K1/19
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