| 摘要 |
A process for manufacturing semiconductor devices is carried out using an apparatus comprising a conversion mechanism having a drive shaft (11), a first rod (12) connected to the drive shaft (11), and a second rod (13) connecting the second rod (12) to a third rod (14) which is guided by means of a linear bearing (16, 17). The mechanism has a lever (21) extending substantially in a transverse direction (x) perpendicular to a stamping direction (z). The third rod (14) is coupled to the lever (21) via a first coupling, in this case a fourth rod (33) which is coupled at a first end to the third rod (14) via a rotary coupling (31) and is coupled to the lever (21) via a rotary coupling (32). The lever (21) is further coupled to the chassis (50) via a second coupling (40) and is coupled to a plunger (71) via a third coupling (60). The second coupling (40) is formed in this case by a fifth rod (43) that is coupled at a first end to the chassis (50) via a rotary coupling (41) and is coupled to the lever (21) via a rotary coupling (42). The fourth rod (33) and the fifth rod (43) are equal in length. As a result there is no substantial resultant force on the lever (21) in the transverse direction (x). A stamping tool (74) is mounted on the plunger (71) for stamping semiconductor devices (80) in a stamping process according to the invention. The semiconductor devices (80) consist of a carrier (81) on which a die (82) is mounted. During the stamping process, the shaft (11) is rotated and the plunger (71) with the stamping tool (74) are moved in the stamping direction (z) in a reciprocating manner. When the stamping tool (74) is lifted, a strip (85) comprising semiconductor devices is moved such that a semiconductor device (80) is positioned under the stamping tool (74). Subsequently the stamping tool (74) is lowered whereby the leads (86) are cut loose from the st
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