| 摘要 |
PURPOSE: To obtain a semiconductor device and its manufacturing method which can relieve distortion stress applied to a metal bump and improve mounting reliability while underfill resin between a semiconductor chip and a mounting substrate is made unnecessary, evade damage to a peripheral device or the like containing the mounting substrate in the case or recovery processing, and realize low cost. CONSTITUTION: In this semiconductor device, an electrode pad 18 formed in the semiconductor chip 21 is connected with each corresponding electrode of the mounting substrate via the metal bump 26. The semiconductor device is provided with a passivation film 19 having an aperture part exposing the electrode pad 18 formed in the chip 21, a salient electrode part 20 whose one end is connected with the electrode pad 18 through the aperture part, a post electrode 16A connecting the other end of the electrode part 20 with the metal bump 26, and an insulating resin layer 13 which has elasticity and covers the post electrode part 16A excepting its end surface, the salient electrode part 20 and the passivation film 19. |
