| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board where a through hole can be properly formed by a laser, and the manufacturing method of the printed-wiring board. SOLUTION: A through hole 32 is punched by a laser on a core substrate 30 consisting of a core material 30a where a heartwood is impregnated with resin, and a resin insulating layer 30b that is formed onto both the surfaces of the core material 30 and is subjected surface roughening. The through hole is punched while a metal layer is not being formed, thus properly forming the through hole, and hence improving the connecting reliability of the printed- wiring board.
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