| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of originally unnecessarily excess material of a supporting board of a circuit device having a circuit element mounted on a printed board, a ceramic board, a flexible sheet or the like as the supporting board and an increase in size of the device in thickness of the supporting board. SOLUTION: After an isolating groove 54 is formed on a conductive foil 60, the circuit element is mounted, and covered with an insulating resin 50 with the foil 60 as a supporting board. Then, the foil 60 is inverted upside down, and with the resin 50 as the supporting board, the foil is polished and separated as a conductive path. Accordingly, a circuit device in which a conductive path 51 and a circuit element 52 are supported to the resin 50 can be realized without adopting the supporting board. Further, wirings L1 to L3 absolutely necessary are in the circuit, and a bent structure 59 and an overhang 58 are incorporated to prevent the wirings from being drawn. |
