| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base circuit board excellent in heat dissipating properties with good productivity. SOLUTION: The metal base circuit board is manufactured by etching a metallic foil comprising a laminate formed by laminating the metallic foil on a metal plate through an insulating layer by a rolling method. The insulating layer is composed of a resin with a spherical alumina powder, and a particle size distribution of the spherical alumina powder including 60 mass % or more particles of an average particle size of 10μm or more, and 40 mass % or less of particles of an average particle size of lower than 10μm. Preferably, the filling amount of the spherical alumina in the insulating layer is 75-95 mass %.
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