| 摘要 |
PURPOSE: A method for molding a lead of a semiconductor device is provided to prevent a coating layer thinly-plated on a lead from being peeled off, by processing the lead while automatically transferring the leads to a plurality of lead molding dies and by preventing excessive force is simultaneously applied to the lead. CONSTITUTION: A cutting groove(30) is formed in a sectional portion of a lead(10) of a plurality of semiconductor devices(1). The lead is bent downward by the first bending process. The lead is again bent by the second bending process. The lead is separated from a leadframe(2) by a cutting process.
|
