| 摘要 |
An integrated passive device array structure with a value that is programmable during manufacturing. The device structure includes a substantially conductive first layer having a plurality of passive device array elements of the integrated passive device array structure disposed above the substantially conductive first layer. The device further includes an insulating layer formed above the plurality of passive device array elements. One or more vias are selectively formed in the insulating layer. The vias facilitate electrical connections between selected ones of the plurality of passive device array elements with a substantially conductive second layer subsequently deposited above the insulating layer.
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