发明名称 |
A MOLDING MATERIAL AND A MOLDED ARTICLE |
摘要 |
<p>A phenolic resin composition in which the phenolic resin can be smoothly cur ed at a low temperature while inhibiting the generation of free formaldehyde an d trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for fr ee phenol. The phenolic resin has been sulfoalkylated and/or sulfaalkylated so as to have improved hydrophilicity.</p> |
申请公布号 |
CA2399736(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
CA20012399736 |
申请日期 |
2001.02.05 |
申请人 |
NAGOYA OILCHEMICAL CO., LTD. |
发明人 |
KAJITA, TAKEHIKO;ITOU, KUNINORI;OGAWA, MASANORI;HORIKI, SEINOSUKE |
分类号 |
C08G8/28;C08G14/12;C08J3/24;C08L61/06;C08L61/14;C08L63/00;(IPC1-7):C08G59/62;C08J5/24 |
主分类号 |
C08G8/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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