发明名称 A MOLDING MATERIAL AND A MOLDED ARTICLE
摘要 <p>A phenolic resin composition in which the phenolic resin can be smoothly cur ed at a low temperature while inhibiting the generation of free formaldehyde an d trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for fr ee phenol. The phenolic resin has been sulfoalkylated and/or sulfaalkylated so as to have improved hydrophilicity.</p>
申请公布号 CA2399736(A1) 申请公布日期 2001.08.16
申请号 CA20012399736 申请日期 2001.02.05
申请人 NAGOYA OILCHEMICAL CO., LTD. 发明人 KAJITA, TAKEHIKO;ITOU, KUNINORI;OGAWA, MASANORI;HORIKI, SEINOSUKE
分类号 C08G8/28;C08G14/12;C08J3/24;C08L61/06;C08L61/14;C08L63/00;(IPC1-7):C08G59/62;C08J5/24 主分类号 C08G8/28
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