WÄRMELEITE-BEFESTIGUNG EINES ELEKTRONISCHEN LEISTUNGSBAUELEMENTES AUF EINER LEITERPLATTE MIT KÜHLBLECH

摘要

The method provides a heat conductive fastening of an electronic component (106) onto a circuit board. The latter has a cooling element (101), e.g. a cooling plate or a cooling body. The active component (106) is soldered flat to the cooling plate. The plate itself is earthed at least in the region of its connection point (105) with the active component (106), e.g. by a coating of tin, gold, silver, nickel, palladium or a tin alloy and/or at least one coating lacquer. The side of the cooling plate to which the active component is to be fastened is provided with at least one corner point. The inner surface of this one corner point is filled with adhesive before soldering.