| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor mounting structure having good high frequency characteristics. SOLUTION: A semiconductor chip 3 provided with bonding bumps 4 is mounted on a carrier board 1 which is mounted on a mounting board 5 facing the surface of the board 1 on the semiconductor chip 3 side. Since the semiconductor chip 3 can be handled in the unit of the carrier board 1, long term continuity test and measurement of high frequency characteristics can be facilitated and the reliability can be enhanced because an IC can be protected against breakdown at the time of searching the cause of failure. Since the semiconductor chip 3 is bonded to the carrier board 1 through small bonding bumps 4, good electrical characteristics (especially high frequency characteristics) can be sustained. |
