发明名称 Mounting board, method of manufacturing the same and method of mounting electronic-circuit element
摘要 After a isolation trench is formed in a conductive foil 70, insulating resin 50 is coated on the conducting foil 70 serving as a supporting board. The conductive foil 70 is turned upside down. Using the insulating resin 50 as another supporting board, the conductive foil is ground so that it is separated into the conductive passages. Thus, the mounting board can be constructed and manufactured using necessary and minimum material. The mounting board which can prevent the conductive passages from coming off can be realized by embedding the conductive passages 51 in the insulating resin to curve the side wall of each conductive passage 51 and/or make a visor coated on the conductive passage. <IMAGE>
申请公布号 EP1122988(A2) 申请公布日期 2001.08.08
申请号 EP20000308680 申请日期 2000.10.03
申请人 SANYO ELECTRIC CO., LTD. 发明人 SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;SAKAMOTO, JUNJI;MASHIMO, SHIGEAKI;OKAWA, KATSUMI;MAEHARA, EIJU;TAKAHASHI, KOUJI
分类号 H05K1/14;H01L21/48;H01L21/68;H01L23/12;H05K1/09;H05K3/04;H05K3/06;H05K3/10;H05K3/20 主分类号 H05K1/14
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