发明名称 LASER PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser processing method for protecting turning-up of an edge portion of a protection sheet that is cut and left on a processed work during a cutting processing. SOLUTION: A laser bam L is irradiated to a processed work 3 while gas is injected toward the processed work 3 through both of a gas passages 6 and 7 so that processed work 3 can be cut at a predetermined profile. Further, the processed work 3 is supported on a non-illustrated worktable so that a side of a protection sheet 5 on the processed work is in an upside position. Pressure of gas in a second gas passage 7 during a cutting processing is higher than the pressure of gas in a first gas passage 6. During a cutting processing, edge portions 5A, 5A of the protection sheet 5 at a cut place 3A is strongly pushed toward a base material 4 by gas of the second gas passage 7.</p>
申请公布号 JP2001212690(A) 申请公布日期 2001.08.07
申请号 JP20000024485 申请日期 2000.02.01
申请人 SHIBUYA KOGYO CO LTD 发明人 NAKAMURA SEIICHI
分类号 B23K26/18;B23K26/00;B23K26/06;B23K26/14;B23K26/38;(IPC1-7):B23K26/18 主分类号 B23K26/18
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