SEMICONDUCTOR MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor mounting structure having a higher heat radiation property. SOLUTION: A semiconductor chip 2 is disposed on one side of a substrate 1 and a heat sink 7 is mounted thereon and has a recess 8 which houses the semiconductor chip 2 and contacts the backside of the semiconductor chip 2 opposite to the substrate 1. Thus, heat of the semiconductor chip 2 can be dissipated directly to the heat sink 7.