| 摘要 |
PURPOSE: An apparatus for correcting a wafer marking system is provided to make possible the correcting for the whole region that is markable by using the correcting plate of the same diameter as a circular wafer so as to correct the path of a laser beam. CONSTITUTION: A correcting plate is set in the position of a wafer(22), and the laser beam from a laser assembly(28) is inputted in a hole by using an x-axis scanner(24) and a y-axis scanner(26). The laser beam is detected in an optical sensor, and the detected signal is stored in a computer(30) as a position correcting value. By using this method, the position correcting value detected in all holes is stored in the computer(30) as data. Then, the correcting plate of circular type(32) guides the laser beam to irradiate in the inside of the wafer(22), and makes the laser beam reach the die(22a) which is circuit-patterned in the wafer(22). After removing the correcting plate(34), the wafer is loaded in the inside of the chamber(20) and set, then the logo, which is inputted in the die(22a) of the position that is corrected in the computer(30), is marked.
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