发明名称 Method of gap filling a conductive slip ring
摘要 In a wrapped ring manufacturing process for slip ring assemblies, the assembly is heated to expand a gap between ends of the slip ring. A conductive material is then used to fill the expanded gap, to assure compression of the conductive material and to eliminate cracks therein. The filled gap is electroplated with a precious metal to form a layer of material of uniform hardness, wear resistance, electrical conductivity and environmental resistance around the entire perimeter of the slip ring.
申请公布号 US6266876(B1) 申请公布日期 2001.07.31
申请号 US19990438403 申请日期 1999.11.12
申请人 LITTON SYSTEMS, INC. 发明人 LAWSON GLENN E.;COLE STEPHEN R.;BOWMAN ANTHONY L.;DAY MICHAEL J.
分类号 F16C13/00;H01R43/10;H02K15/02;(IPC1-7):H01R43/00 主分类号 F16C13/00
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