发明名称 LID MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a lid material which does not generate bubbles on an interface of a paper layer due to heat when heat-bonding the lid material to a container even in a structure having a non-air-permeable layer on an external surface of the paper layer. SOLUTION: The lid material comprises a laminate structure including, from the exterior, the non-air-permeable layer, the paper layer and a heat-bonding resin layer. Fine flaws reaching the paper layer through the non-air-permeable layer on the external surface are formed on at least a peripheral region of the lid material including a heat-bonded region when the lid material is heat- bonded to the container.
申请公布号 JP2001206447(A) 申请公布日期 2001.07.31
申请号 JP20000018491 申请日期 2000.01.27
申请人 DAINIPPON PRINTING CO LTD 发明人 KANEMURA YUKIMICHI
分类号 B65D77/20;(IPC1-7):B65D77/20 主分类号 B65D77/20
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