发明名称
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating and transporting process apparatus for transporting a wafer while heating it and for independently performing pressure control and temperature control on a vacuum chamber, which is formed in combination with each process chamber. SOLUTION: A substrate heating section 36 having a cylindrical housing 35 including flanges 31 and 33 on the ends, a lamp holder disposed on a center line of the housing 35, and a lamp heater disposed on the lamp holder, comprises a substrate rotating mechanism for rotating a substrate holder. The substrate heating section 36 is vacuum-shielded and held at the flange 31 of the housing 35 onto a transporting plate 38, which is moved by a rotating and moving shaft 43 in a rotationally transporting direction and a horizontal direction. The shaft 43 is rotated by a rotation mechanism 60 while vacuum-shielding a common chamber, and is horizontally moved by a moving mechanism 70.
申请公布号 JP3192404(B2) 申请公布日期 2001.07.30
申请号 JP19980258968 申请日期 1998.09.11
申请人 发明人
分类号 H01L21/677;C23C14/56;H01L21/203;H01L21/324;H01L21/68;(IPC1-7):H01L21/203 主分类号 H01L21/677
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