| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed-circuit board having a BVH or an IVH, which can enhance the reliability of a soldering connection used to connect a conductor member for circuit formation to a conductor member on an outer layer, by improving the problem, where after the multilayer printed-circuit board is laminated and molded and when a blind hole for the BVH or the IVH is worked so as to be plated and treated, a plating liquid is not circulated well into the blind hole in the case of the worked blind hole having a small hole diamater, that the air which remains inside the hole is hard to remove, and that the inner part of the hold is plated to be thin or the innermost part of the hole is not plated. SOLUTION: The multilayer printed-circuit board is provided with the via hole, which is used to connect a first conductor member and a second conductor member which are isolated by an insulating layer. In the multilayer printed- circuit board, the via hole is formed in a long-hole shape which has a minor axis part and a major axis part in the insulating layer on the first conductor, and the side face shape of at least one end in the major-axis direction has an angle of inclination, which is expanded toward the surface from the bottom part of the hole. |
