| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared sensor of high mechanical strength capable of arranging a thermocouple with high density and capable of efficiently trans mitting heat generated in a heat absorbing layer to the thermocouple. SOLUTION: This sensor is provided with a support member including a support film 3 and a substrate 1 having a hollow portion 2 to support the support film 3, polysilicon films 4 formed ranging over from an upper part of the hollow portion 2 to an upper part of the substrate 1, SiO25 formed on the polysilicon films 4 and having the first contact hole in the upper part of the hollow part 2 and the second contact hole in the upper part of the substrate 1, an aluminium film 6 connected to the polysilicon film 4 via the first contact hole and connected to the adjacent polysilicon film 4 via the second contact hole, and the heat absorbing layer 8 formed in the upper part of the hollow portion 2 to cover the upper part of the first contact hole. The aluminium film 6 is layered in the upper part of the hollow portion 2 via the corresponding polysilicon film 4 and SiO25.
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